wafer fabrication
Hendon Semiconductors has considerable experience in the operation of wafer fabrication. However, to guarantee our customers the high quality and high quantity delivery performance demanded by OEM’s and customers in global markets, this is now outsourced to globally recognised commercial wafer fabrication facilities. Access to Multi Project Wafer (MPW) programmers enables us to shorten the design and approval cycles of the design flow. Our supplier partners’ requirements also interface with our design tools and design flow thereby ensuring the optimum outcomes in terms of quality, yields and reliability.
wafer probing and final (packaged) test
The development of integrated circuit testing is an integral part of the design/flow and characterisation/ verification process. We have the expertise in the development of in-house integrated circuit testers and the software and test interface development.
delivery packages and formats
We use packaging services from commercial packaging companies. This provides us with package options to meet most customers’ demands of the various current assembly options. See Package and Soldering datasheet for more information.
RoHS compliance
Our policy is to comply with the standards for meeting RoHS compliant products. See the RoHS Information page for more information.